JS-668 is a high-reliability, high-lead solder paste produced by our company for packaging and soldering power devices such as IGBTs and MOSFETs. Reflowed in reducing or inert atmospheres, it leaves extremely low residue, meeting the ultra-low void soldering requirements for IGBTs and automotive-grade power devices. The product is suitable for automated dispensing and printing processes.

JS-880 is a high-reliability lead-free formic acid solder paste developed by our company. Uses high-purity lead-free Sn96.5Ag3Cu0.5 (Type 4 / 5 / 6 powder, melting point 217°C) alloy solder powder. Reflowed in a formic acid reducing atmosphere, it meets the ultra-low void soldering requirements for IGBTs and automotive-grade power devices. It can completely replace existing cleaning-type solder paste and solder preform processes, achieving no-clean savings and significantly reducing costs for customers in terms of environmental impact, process steps, and materials. The product is suitable for automated dispensing and printing processes.

JS-990 is a high-reliability, lead-free formic acid solder paste developed by our company. Uses high-purity tin-antimony Sn90Sb10 alloy (Type 4 / 5 powder, melting point 235-255°C) solder powder. Reflowed in a formic acid reducing atmosphere, it meets the ultra-low void soldering requirements for IGBTs and automotive-grade power devices. It can completely replace existing cleaning-type solder paste and solder preform processes, achieving no-clean savings and significantly reducing costs for customers in terms of environmental impact, process steps, and materials. The product is suitable for automated dispensing and printing processes.

JS-950-M is a high-reliability, lead-free, high-temperature, no-clean solder paste developed by our company. Uses high-purity lead-free Sn95Sb5 alloy (Type 4 / 5 powder, melting point 235-245°C) solder powder. Reflowed in reducing/inert atmospheres, it meets the ultra-low void soldering requirements for IGBTs and automotive-grade power devices. Extremely low residue allows customers to potentially meet no-clean requirements to some extent, offering high reliability and significantly reducing costs for customers in terms of environmental impact, process steps, and materials. The product is suitable for automated dispensing and printing processes.