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Applications

LED MiniLED packaging and assembly materials

MiniLED/MicroLED solder paste

Die attach solder paste
SMT electronic assembly solutions

Laser/Hot bar solder paste

Lead-free SMT solder paste/Low-temperature lead-free solder paste

Leaded SMT solder paste
Semiconductor packaging materials

Rosin water-wash formic acid no-clean sintered copper
Photovoltaic new energy materials

HJT low-temperature paste

IBC insulating adhesive

PV module solder paste

Product Application

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Product Center: Lead-free Series; Leaded Series; Formic Acid Series; COB Adhesive; LED Filament Adhesive; Other Adhesives

Applications: LED MiniLED packaging and assembly materials; SMT electronic assembly solutions; Semiconductor packaging materials; Photovoltaic new energy materials

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