晨日焊料

 

 

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锡 膏
助焊剂
助焊膏
BGA锡球
无铅焊料
焊接设备

  应用范围:
    主要应用在应变计、传感器、保险管、连接器、导线等焊接和电子产品在线焊
  接与维修和BGA、CSP芯片封装与返修,起助焊作用,对表面钝化处理(镀镍、镀黄
  铜等)的金属和普通锡、铜焊盘均有良好的润湿性和可焊性,其形态为粘状的树脂
  通常为透明的浅黄色和透明的乳白色,满足无铅工艺制程,BGA封装焊接。

  ES-F300、ES-F400:
  Standards and Performance
Items Standard / Performance Test Method
Appearance High viscosity,canary,and paste,state. juding By Eye
Viscosity(Pa.s,25℃)
18 (Reference value) Brookfield DVⅢ T-B
Ti value (Pa.s,25℃) 2.5±0.5 Brookfield DVⅢ T-B
Chlorine content (mass%) 0.01 or less MIL-F14256F
Acid value (LoH/g) 110±15 MIL-F14256F
PH value 5.5±0.5 MIL-F14256F
Spreading (%) 94 JIS-Z-3197-6.10
 
  ES-F500、ES-F600:
  Composition/
Ingredient Information
Hazardous Ingredients

C.A.S.
Number

Weight percent OSHA
PLE mg/m3
ACGIH TLV TWA mg/m3 LD 50 ingested g/Kg LD 50 Inhales
g/Kg
Modified Rosins NA < 45 NE NE NE NE
Terpineol 800-41-7 < 15 NE NE NE NE
Mixed Carboxlic Acids NA < 4 NE NE NE NE
Non-Hazardous Ingredients
surfactants NA < 4 OSHA:Occupational Safety and Health Adminstration
PEL:Permissible Exposure Limit
ACGIH:American Conference of Gov.Indus.Hygienists
TLV:Threshold Limit Valuse
STEL:Short-Term Exposure Limit
TWA:Time Weighted Average
C.A.S.:Chemical Abstract Service
Rheological Modifier NA < 5
   
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