ES-380 is a low-silver lead-free solder paste, an air reflow, no-clean solder paste.It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. high activity, cost-effective adoption of lead-free spherical powders and additives. Applied to generic lead-free environmentally friendly electronic Assembly.
• High oxidation barrier to eliminate grapping and HIP defects
• high probe testability of minimizes false failures in ICT
• high activity, oxidation resistance is strong, bright surface of solder, very few residues and features such as transparent, comparable with SAC305 solder paste
• Highly probe testable flux residue
• Halogen-free per EN14582 test method
• Excellent print transfer efficiency on 0.4mm pitch CSPs