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It is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is designed to give excellent protection from
failure due to mechanical stress. The low viscosity allows filling in gaps under CSP or BGA.
 |
Type |
Application |
Viscosity |
Reworkability |
Colour |
|
Es9515
|
CSP/BGA
|
400cps
|
yes
|
Opal
|
|
|
Curing |
Storage |
Packaging |
|||
|
150℃ 3-5min
|
Sealed refrigeration 6 months/5℃
|
250ml/30ml/50ml
|
|||
|
Type |
Application |
Viscosity |
Reworkability |
Colour |
|
|
Es9516
|
CSP/BGA
|
400cps
|
yes
|
Black
|
|
|
Curing |
Storage |
Packaging |
|||
|
150℃ 3-5min
|
Sealed refrigeration 6 months/5℃
|
250ml/30ml/50ml
|
|||
Typical application
1,It is designed for use as a reworkable underfill resin for CSP(FBGA) or BGA.
2,Primarily used to improve shock resistance (drop&thermal test reliability)
Typical performance
High reliability Fast flow Snap-cure
consistent dispense properties over many shifts Higher productivity Rworkability
Auto filleting Filling in 0.5 mil（0.013mm)gaps