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soder-ball Shenzhen Earlysun Technology co,ltd

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Alloy

Packing

Application

SnAg3Cu0.5
0.889mm 0.76mm
0.65mm 0.60mm
0.55mm 0.50mm
0.45mm 0.40mm
0.35mm 0.30mm
0.25mm 0.20mm

1000, 500
and 50 
thousand
Tablets
/bottle

Pure metal, High-
ball rate, used in
 BGA chip package,
 usually used with
 flux.

Sn63Pb37