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There have three used way for Solder paste:
template printing, dispensing, pin transfer. In the three methods, the dispensing's automation and precision is the highest. It requires high thixotropy and uniformity for this kind of solder paste. It needs to achieve consistent dispensing in the entire operation process and it need higher requirement for the viscosity and chemical stability of this solder paste. 100g/30cc and 35g/10cc.The specific characteristics of each alloy and its application can reference the Products. |