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Series Alloy& Melting Point Application Packing The most common alloy before the
![[s]20097289441.jpg](/d/file/cp/yqty/2009-12-17/6abd9482bb6dbd3fe0e9e723bcf89df6.jpg)
ES-330
SnPb43Bi14
144℃Low-temperature lead base solder
paste, welding strength between the
Sn-Bi and Sn-Ag-Cu, usually used in
low-temperature welding device.35g
100g
500g
1000g
ES-300
SnPb37
183℃
application of Lead-Free solder paste.
Silver in the Sn-Pb alloy can improve
the mobility effectively; improve the
histocompatibility between the solder
paste and pad; effective control of
weld defects.idem
ES-400
SnPb36.8Ag0.4
179-183℃
SnPb36Ag2
179℃
Packaging: 35g is 10CC syringes, 100gis 30CC syringes, 500g is standard bottled, 1000g is bottled or syringes.