High-Lead solder paste of Semiconductorsolder paste,solder paste flux,solderpaste|Earlysun-CHINA

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High-Lead solder paste of Semiconductor

	Series	Alloy	Melting Point	Application	Packing
	ES-500	Sn5Pb95	308℃	High lead, high melting point lloys, lead content is more than 85%. Can meet the ROHS irective. Usually used in package of power semiconductor device, can Miscibility with Au,Cu,Ag,high sidual impedance and good welding strength.	35g 100g 500g 1000g
		Sn5Pb93.5Ag1.5	296℃
		Sn5Pb92.5Ag2.5	287℃
		Sn10Pb90	275℃
		Sn10Pb88Ag2	268℃
	ES-660	Sn5Pb95	308℃
		Sn5Pb93.5Ag1.5	296℃
		Sn5Pb92.5Ag2.5	287℃
		Sn10Pb90	275℃
		Sn10Pb88Ag2	268℃

Reference: ES-660have more Cost-effective than ES-500.
Packaging: 35g is 10CC syringes, 100gis 30CC syringes, 500g is standard bottled, 1000g is bottled or syringes.

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